The Bently Nevada 21000-28-05-00-047-04-02 is a 21000 series Proximity Probe Housing Assembly. Pre-configured with 3300 XL 8 mm probe with selectable approvals, 0.5 m (20 in) cable, and 0.0mm standoff adapter. Provides secure probe mounting and environmental protection for industrial vibration monitoring applications.
The 21000-28-05-00-047-04-02 is a Proximity Probe Housing Assembly manufactured by Bently Nevada (Baker Hughes). This product is designed for professional rotating machinery monitoring and protection applications.
Configured for direct analog signal acquisition in Emerson DeltaV DCS environments, the Emerson KJ3002X1-BG2, also cataloged as the KJ3002X1-BG2 Thermocouple Module, provides direct physical/electrical execution.
Hardware Specifications
Parameter
Specification
Model
KJ3002X1-BG2
Brand
Emerson
Part Number
12P1731X022
System Reference
VE4003S5B1
Range of Product
DeltaV M-series I/O Subsystem
Module Type
Thermocouple Module
Channels
8 Channels
Origin
USA
Weight
0.2 kg
Dimensions
8.1 x 7.9 x 8.8 cm
HS Code
8537101190
Status
Discontinued (Dec 31, 2018)
Process Control and DCS Characteristics
Converts millivolt inputs from field thermocouples into digitized temperature values for system controller processing.
Features integrated cold junction compensation (CJC) algorithms to maintain signal accuracy across varying cabinet temperatures.
Utilizes channel-to-channel isolation architecture to eliminate ground loops and reject common-mode voltage spikes across industrial field cabling.
Incorporates 4-20 mA HART loop protocol carrier compatibility across system backplane interfaces for extended instrument diagnostic passthrough.
Frequently Asked Questions
Q: How does the KJ3002X1-BG2 module perform cold junction compensation?A: Cold junction compensation is maintained via internal thermal sensors embedded on the terminal block assembly, correcting for ambient variations at the wiring termination point.Q: Can the module be inserted or removed while the terminal base is powered?A: Yes, DeltaV M-series I/O modules support power-on insertion and removal (removal under power) when installed on compatible I/O carrier bases.
Field Installation Guidelines
Secure the module onto the DeltaV M-series I/O carrier until the locking mechanisms fully engage with the backplane base.
Ensure shielded thermocouple wiring is grounded at a single point to prevent high-frequency noise interference on low-millivolt input channels.
Maintain a minimum bending clearance for field wiring to prevent mechanical stress on terminal connectors.
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