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SKU: IC694MDL930
GE IC694MDL930 PACSystems RX3i Voltage Output Module
Secure the authentic GE IC694MDL930 PACSystems RX3i relay voltage output module. Available in brand new original stock condition with global shipping. Request a technical quote to secure verified, high-isolation industrial hardware.
The GE IC694MDL930, also cataloged as the IC694MDL930 Voltage Output Module, operates as a dedicated hardware component for discrete circuit switching within PACSystems RX3i platforms. Configured as an 8-channel relay output interface, the module provides isolated contact execution between the high-speed controller backplane and external fields, managing inductive and resistive loads like solenoids, contactor coils, and industrial status indicators.
Hardware Specifications
| Parameter | Specification |
|---|---|
| Model | IC694MDL930 |
| Brand | GE |
| Origin | USA |
| Weight | 0.3 kg |
| Dimensions | 3.5 x 13.2 x 13.5 cm |
| Operating Temp | 0 to 60 deg C |
| Power Consumption | 120 mA at 5 VDC via backplane |
| Module Type | Voltage Output Module (Relay Output) |
| Output Channels | 8 isolated Form A (Normally Open) |
| Voltage Range AC | 5 to 250 VAC (120/240 VAC nominal) |
| Voltage Range DC | 5 to 30 VDC (24 VDC nominal) |
| Current Rating (Resistive) | 4 A maximum per channel |
| Current Rating (Pilot Duty) | 2 A maximum per channel |
| Minimum Load Current | 10 mA per channel |
| Turn-On / Turn-Off Time | 15 ms maximum (typical) |
| Channel-to-Channel Isolation | 250 VAC continuous / 1500 VAC for 60 seconds |
| System Platform | PACSystems RX3i / Series 90-30 baseplates |
| HS Code | 8537101190 |
Backplane Bus Communication Velocity and Firmest I/O Status Diagnostics
The module interfaces directly through the unified backplane bus communication velocity architecture of the RX3i chassis, allowing deterministic status processing within the master CPU execution cycle. The front panel features eight independent diagnostic LED indicators connected directly to the coil-side drive circuitry to verify the state of each logical channel. For distributed operations, firmware flash compatibility supports deployment in remote I/O terminal racks managed via Profinet or EtherNet/IP interface adapters, preserving data update speeds across network links.
Frequently Asked Questions
Q: Why does each of the 8 relay channels possess an independent common terminal?
A: The provision of separate common terminals establishes complete electrical isolation between channels, allowing a single module to concurrently switch mixed voltage types (e.g., 24 VDC on Channel 1 and 240 VAC on Channel 2).
Q: What are the thermal current limitations for this hardware when all channels are energized?
A: While each individual channel supports up to 4 A resistive load, the cumulative maximum load current across the entire module terminal block is capped at 30 A under UL operating conditions.
Q: Can this module be hot-swapped in an active PACSystems RX3i backplane slot?
A: No. Prior to extracting or inserting the module into the baseplate slot, all field-side power lines and chassis backplane power must be fully isolated to prevent arcing and internal logic degradation.
Field Installation Guidelines
- Terminal Assembly Seating: Verify that the high-density terminal block latch is locked prior to applying field voltage. Ensure the module chassis is fully inserted into the RX3i baseplate slots to achieve a continuous electrical bond with the carrier ground bar.
- Inductive Surge Suppression: Install external suppression devices across all inductive loads. Use RC networks for AC circuits and commutating diodes for DC circuits to clear voltage spikes and extend the operational life of the internal silver alloy contacts.
- Conduit and Wire Separation: Track low-voltage communication lines through separate physical paths away from the 250 VAC field switching wires terminating at the module front face to suppress electromagnetic noise cross-talk.
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