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SKU: IC200CHS022

GE Fanuc Emerson IC200CHS022 VersaMax Compact Box-Style I/O Carrier

The GE Fanuc IC200CHS022 is a 36-terminal, box-style I/O carrier for the VersaMax series. It supports high-density field wiring, DIN-rail mounting, and tool-free module replacement to maximize system uptime and reliability.

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Versatile Wiring Foundation for Automation

The IC200CHS022 serves as a robust terminal base within the Emerson VersaMax ecosystem, acting as the primary physical and electrical interface for various I/O modules. By decoupling the wiring from the active electronics, this carrier allows technical teams to establish field connections before the control modules arrive. Because the carrier supports a broad range of VersaMax modules, it provides a standardized platform for industrial signals, ensuring that electrical layouts remain consistent across the control cabinet.

Robust Terminal Configuration and Capacity

To facilitate dense wiring in a small footprint, the hardware incorporates 36 IEC-standard box-style screw terminals. These terminals accommodate both solid and stranded copper conductors, providing secure mechanical retention for critical field signals. Furthermore, the internal architecture organizes these connections into two distinct rows, labeled A1 through A18 and B1 through B18, which significantly simplifies the mapping of complex I/O circuits.

  • Wire Compatibility: Supports single-wire connections from AWG #14 (2.1 mm²) to AWG #22 (0.36 mm²).
  • Current Ratings: Individual terminals manage up to 2 Amps, while the integrated power and ground segments handle a collective load of 8 Amps.
  • Voltage Endurance: Rated for operational voltages between 0 and 264 VAC, with a transient protection threshold reaching 300 VAC.

Installation Flexibility and Thermal Management

The IC200CHS022 supports multiple mounting orientations, including standard 35mm DIN-rail clipping and direct panel mounting using screws. Consequently, control engineers can adapt the carrier to suit the specific physical constraints of their enclosures. To maintain peak performance and prevent thermal throttling, the installation guidelines recommend maintaining a 1-inch horizontal clearance and a 2-inch vertical clearance for adequate airflow. Additionally, the unit features a hinged card holder that protects the terminal wiring while simultaneously securing the installed I/O module in place.

Maintenance Efficiency

One major advantage of this modular design is the “hot-swapping” capability. Maintenance personnel can replace or upgrade active I/O modules without disturbing the existing field wiring, which effectively eliminates the risk of rewiring errors and drastically reduces system downtime. This characteristic makes the IC200CHS022 an essential component for high-availability industrial environments operating within the 0 to 60°C temperature range.

Technical Specifications

  • Manufacturer: GE Fanuc / Emerson Automation
  • Series: VersaMax
  • Part Number: IC200CHS022
  • Type: Compact Box-Style Carrier
  • Terminal Count: 36 Screw Terminals
  • Dimensions: 66.8 mm x 70.0 mm x 163.5 mm
  • Mounting Options: 35mm DIN-rail or Panel Mount
  • Net Weight: 0.24 kg
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Hardware Specifications

ParameterSpecification
ModelIC694MDL645
BrandGE
OriginUSA
Weight0.3 kg
Dimensions3.5 cm x 13.2 cm x 13.5 cm
Operating TempStandard Industrial Range
Power ConsumptionBackplane Dependent
Input Channels16
Rated Voltage24 VDC
ON-state Voltage11.5 VDC to 30 VDC
OFF-state Voltage0 VDC to 5 VDC
Response Time7 ms (typical)

PLC and Control Network Integration

System communication velocity and deterministic performance are regulated by the PACSystems backplane architecture. Signal integrity is preserved through high-level galvanic isolation, rated at 1500 VAC for one minute, whereby electrical noise interference is mitigated. Furthermore, firmware flash compatibility is ensured during module replacement, provided that the backplane remains energized within the specified voltage tolerances. The module is engineered for integration within both local and remote RX3i I/O racks, while support for RX7i systems is provided exclusively in distributed I/O configurations.

Frequently Asked Questions

Q: Is the module capable of being hot-swapped while the system is powered?A: Yes, the module is designed to be extracted and inserted while the RX3i backplane is energized; however, field wiring must be verified to ensure no short-circuit conditions are created during the removal process.Q: How is the signal response time managed in high-speed applications?A: A typical response time of 7 milliseconds is imposed by the hardware filter circuits. This latency is inherent and should be accounted for when high-speed pulse capture is required.

Field Installation Guidelines

  • The module is to be mounted onto the designated RX3i backplane slot. A mechanical click is heard when the module is fully seated.
  • Prior to wiring, the 24 VDC power supply must be verified for voltage stability.
  • Signal wires are to be connected to the terminal block. A secure, firm connection is required to prevent intermittent signal loss caused by vibration.
  • Shielding must be grounded at the designated earth terminal to ensure that electromagnetic interference is properly diverted.
  • Once the module is seated and wired, the status LEDs are to be inspected for illumination corresponding to active field device states.
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Configured for redundant processing tasks in Series 90-70 networks, the GE IC697CGR935 (IC697CGR935 One Slot Controller Module) provides direct physical and electrical execution of logic in hot-standby architectures. This controller operates with a 96 MHz 80486DX4 microprocessor to manage up to 12K discrete I/O points and 8K analog I/O points. Synchronization between primary and secondary units is maintained through backplane communication, facilitating seamless failover transitions.

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ParameterSpecification
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Operating Temp0 deg C to 60 deg C
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Processor96 MHz 80486DX4
Memory1 MB
Execution Speed0.4 microseconds (Boolean)

Industrial Control System Performance

The IC697CGR935 relies on high-velocity backplane bus communication to ensure deterministic synchronization between redundant modules. Furthermore, firmware flash compatibility allows for controlled version updates within the Series 90-70 environment, thereby maintaining consistency across logic execution cycles. In addition, I/O density scaling is supported through the backplane interface, which enables the controller to process large datasets without exceeding defined timing constraints. Finally, Profinet and EtherNet/IP deterministic network integration requirements are managed via specific communication coprocessors when utilized in integrated automation architectures.

Frequently Asked Questions

Q: What is the failover behavior if the primary controller experiences a fault?A: In a redundant pair, the secondary controller monitors the heartbeat of the primary. Upon detection of a primary fault, the secondary transitions to the active state instantaneously to prevent interruption of the process control loop.Q: Are there specific thermal requirements for operation at ambient temperatures above 50 deg C?A: Yes. Forced air cooling is required when the operating environment exceeds 50 deg C to ensure the heat dissipation of the 80486DX4 microprocessor and internal circuitry remains within specified safe limits.

Field Installation Guidelines

  • Ensure the rack slot is free of debris before inserting the module to guarantee proper contact with the backplane connector.
  • The module must be seated flush against the rack frame and secured using the provided mounting hardware to ensure electromagnetic compatibility and grounding.
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  • Upon initial power-up, verify that the 3-position switch is set to the correct mode (Run/Stop) and that status LEDs indicate valid processor health before establishing field I/O connectivity.
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Suffix Breakdown & Model Matrix

The available documentation identifies a single catalog number, IC694MDL240, without any documented suffix variants or ordering-code subdivisions. No suffix matrix is specified by the manufacturer data provided.

Hardware Specifications

ParameterSpecification
ModelIC694MDL240
BrandGE
Product SeriesPACSystems RX3i
Module TypeVolt AC Input Module
Input Channels16 discrete inputs
Input Voltage Range85-132 VAC
Nominal Input Voltage120 VAC
Input Frequency50/60 Hz
ON-State Voltage74-132 VAC
OFF-State Voltage0-20 VAC
ON Response Time30 ms
OFF Response Time45 ms
Backplane Current Consumption90 mA
Isolation Rating250 VAC continuous, 1500 VAC for 1 minute
Status IndicationIndividual channel LEDs
MountingSingle-slot RX3i backplane installation
OriginUSA
Weight0.28 kg
Dimensions3.5 x 13.2 x 13.5 cm
Operating TempNot specified in provided documentation
Power ConsumptionNot specified in provided documentation
ComplianceUL 508
Environmental ClassificationClass 1, Division 2 compatible applications

Backplane Communication and I/O Density Scaling

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Frequently Asked Questions

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Field Installation Guidelines

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  • Confirm correct channel addressing and field terminal assignments before controller startup.
  • Inspect LED channel indicators during commissioning to verify correspondence between field device operation and controller input status.
  • Follow lockout and electrical safety procedures before connecting or disconnecting field wiring.
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