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- ABB GDC806A2002 3BHE028761R2002 Advant OCS/800xA
SKU: GDC806A2002 3BHE028761R2002
ABB GDC806A2002 3BHE028761R2002 Advant OCS/800xA
The ABB GDC806A2002 3BHE028761R2002 is a premium DCS Ethernet router circuit board with channel-wise electrical isolation. Brand New, Original Stock, ready for Global Shipping. Secure this authentic automation component today to optimize your system performance.
The ABB GDC806A2002, also cataloged as the ABB 3BHE028761R2002 PCB Card, operates as a dedicated hardware component for signal processing and real-time process control within Advant OCS/800xA system platforms. Configured as an Ethernet router circuit board, this module executes data routing and voltage-regulated interface signals with measurement update intervals under 40 ms.
Hardware Specifications
| Parameter | Specification |
|---|---|
| Model | GDC806A2002 3BHE028761R2002 |
| Brand | ABB |
| Origin | SWEDEN |
| Weight | 1.2 kg |
| Dimensions | 44.8 x 17.3 x 3.2 cm |
| Operating Temp | 0 to 55 deg C (Standard industrial range) |
| Power Consumption | 600 mW |
| Module Type | PCB Card |
| System | DCS (Advant OCS / 800xA) |
| Communication Service | Ethernet router |
| Voltage Regulation (Uo) | Less than or equal to 21 VDC |
| Current Limiting (Ik) | Less than or equal to 28.5 mA |
| Electrical Isolation | Channel-wise isolation rated at 250 Veff |
| Compliance Standard | EN 50020 |
Backplane Bus Communication Velocity Licences
The hardware architecture interfaces directly with the host subrack using dedicated deterministic backplane bus communication velocity Licences. This enables synchronous data transfer between the processing core and the S800 I/O and AC 800M architecture layers. The internal logic handles high-density I/O scaling across parallel channels while managing firmware flash compatibility protocols. This layout minimizes propagation jitter during continuous high-velocity routing procedures without inducing software-driven data buffering overheads.
Frequently Asked Questions
Q: Does the module support hot-swapping under live power conditions?
A: Yes. The modular subrack architecture supports physical hot-swap insertion and removal, provided the local system configuration allows backplane isolation during the swap sequence.
Q: What are the integrated physical protection limitations for the circuitry?
A: The board features channel-wise electrical isolation conforming to EN 50020 with a rating of 250 Veff. It also features integrated current limiting restricted to a maximum of 28.5 mA and voltage regulation capped at 21 VDC.
Field Installation Guidelines
- Ensure complete galvanic isolation and disconnect all primary power supply feeds prior to handling the module to prevent electrostatic discharge (ESD) to the conformal-coated traces.
- Mount the PCB card vertically into the designated subrack slot, verifying that the backplane high-density interconnect pins align precisely before applying insertion pressure.
- Secure all retaining chassis screws to establish an electrical chassis ground path via the subrack frame.
- Terminate all field Ethernet communications lines using shielded twisted pair cables, grounding the overall shield mesh exclusively at the entry point of the industrial enclosure.
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