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SKU: IC693MDL330

GE IC693MDL330 Positive Logic Output Module

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The GE IC693MDL330, also cataloged as the IC693MDL330 Positive Logic Output Module, operates as a dedicated hardware component for discrete AC load control within PACSystems RX3i platforms.

Hardware Specifications

ParameterSpecification
ModelIC693MDL330
BrandGE
OriginUSA
Weight0.28 kg
Dimensions3.5 x 13 x 13.5 cm
Operating Temp0 deg C to 60 deg C
Power Consumption / Output8 output points (120-240 VAC, 2 A max per point)

Backplane Bus Communication and Firmware Compatibility

The module interfaces directly with the PACSystems RX3i backplane bus, utilizing high-velocity backplane communication licenses to execute discrete command outputs across deterministic scan cycles. Firmware flash compatibility enables remote diagnostic updates and parameter configuration without requiring physical module extraction from the baseplate mounting slot.

Frequently Asked Questions

Q: How are the discrete output points grouped and electrically isolated on this module?

A: The 8 output points are arranged into 2 isolated groups of 4 outputs each, allowing separate AC phase connections protected by individual 5 A fuses.

Q: What is the minimum load current requirement for proper operation of each output point?

A: Each output point requires a minimum load current of 100 mA to maintain valid state switching and prevent leakage voltage drop issues.

Field Installation Guidelines

Ensure that all external AC power sources feeding the output terminals are fully isolated before performing insertion or removal from the baseplate slot. Secure the module housing using the integrated top and bottom mounting screws to guarantee proper chassis grounding, and verify that field wiring maintains correct clearance from high-voltage raceways.

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Hardware Specifications

ParameterSpecification
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BrandGE
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Weight0.1 kg
Dimensions11.0 cm x 5.8 cm x 6.5 cm
Operating TempStandard Industrial Range
Power Consumption110.0 mA at 5.0 VDC (Backplane)
Nominal Voltage240 VAC
Input Range0 to 264 VAC
ON-state Voltage155 VAC to 264 VAC
OFF-state Voltage0 VAC to 40 VAC

PLC and Control Network Integration

System communication velocity and deterministic performance are regulated by the VersaMax backplane architecture. Backplane bus communication velocity is optimized to ensure low-latency data throughput for high-density I/O configurations. Furthermore, firmware flash compatibility is supported, allowing for field updates when the module is integrated into existing VersaMax PLC frameworks. To maintain operational stability, I/O density scaling is managed through the modular backplane, which facilitates the addition of supplemental discrete or analog modules without interrupting the host processor scan cycle.

Frequently Asked Questions

Q: Is the module capable of being hot-swapped while the backplane is energized?A: Yes, the module is designed to support hot-swapping. However, care must be taken to ensure that field wiring is disconnected or secured to prevent accidental shorting of the AC input terminals during extraction.Q: How is the group isolation managed across the sixteen channels?A: The sixteen inputs are organized into two groups of eight. While there is no point-to-point isolation, 1500 VAC of group isolation is provided for a duration of one minute to protect against common-mode electrical transients.

Field Installation Guidelines

  • The module is intended for mounting onto a DIN-rail supported I/O carrier. The module must be seated firmly until a physical click is confirmed.
  • Field wiring is connected via the integrated snap-in terminal blocks. Standard industrial torque specifications should be applied to prevent contact resistance.
  • AC input leads must be routed away from low-voltage communication cables to mitigate electromagnetic interference.
  • Status LEDs should be verified for correct illumination cycles upon the application of field power. If an LED fails to trigger during a signal state change, the input wiring and voltage levels must be measured against the technical specifications.
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Hardware Specifications

ParameterSpecification
ModelIC697CGR935
BrandGE
OriginUSA
Weight0.75 kg
Dimensions4.0 cm x 21.8 cm x 29.1 cm
Operating Temp0 deg C to 60 deg C
Power Consumption3.1 A
Processor96 MHz 80486DX4
Memory1 MB
Execution Speed0.4 microseconds (Boolean)

Industrial Control System Performance

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Frequently Asked Questions

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Field Installation Guidelines

  • Ensure the rack slot is free of debris before inserting the module to guarantee proper contact with the backplane connector.
  • The module must be seated flush against the rack frame and secured using the provided mounting hardware to ensure electromagnetic compatibility and grounding.
  • Shielded serial cables connected to the RS232 or RS485 interfaces should be grounded at the controller end to mitigate noise interference in high-EMI environments.
  • Upon initial power-up, verify that the 3-position switch is set to the correct mode (Run/Stop) and that status LEDs indicate valid processor health before establishing field I/O connectivity.
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Hardware Specifications

ParameterSpecification
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BrandGE
OriginUSA
Weight0.06 kg
Dimensions11.0 cm x 3.5 cm x 3.0 cm
Operating TempStandard Industrial Range
Power ConsumptionPassive (No active components)
Voltage Rating264 VAC (Up to 300 VAC tolerance)
Current Rating8 A

PLC and Control Network Integration

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Frequently Asked Questions

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Field Installation Guidelines

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