GE Fanuc IC670CHS003 Field Control Terminal Block with Connectors
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SKU: IC670CHS003
GE Fanuc IC670CHS003 Field Control Terminal Block with Connectors
The GE Fanuc IC670CHS003 is a high-density, connectorized I/O terminal block designed for the Field Control series. Featuring dual 20-pin male AMP connectors, it supports rapid wiring, vibration resistance, and seamless I/O module integration for advanced distributed control systems.
The GE IC670CHS003 serves as a specialized I/O terminal block within the GE Fanuc Field Control architecture. Unlike standard screw-type bases, this unit features dual 20-pin male connectors that facilitate a “plug-and-play” interface for field wiring. This design allows technicians to pre-wire harnesses using compatible AMP connectors, significantly reducing the time required for on-site installation and hardware commissioning. Furthermore, the IC670CHS003 acts as a physical and electrical mount for I/O modules, ensuring stable backplane communication while maintaining a high-density footprint in industrial control cabinets.
Engineering Features and Operational Benefits
High-Density Connector Interface: The block incorporates two keyed 20-pin male connectors (AMP 178289-8). Because these connectors are keyed, they prevent accidental cross-wiring and ensure that field devices are always mapped to the correct I/O points.
Modular Wiring Efficiency: By utilizing the IC670ACC003 connector kit, installers can prepare field wiring away from the active control panel. This approach streamlines the assembly process and minimizes the risk of errors during complex system integration.
Vibration-Resistant Connectivity: The terminal block employs industrial-grade D-3000 series contacts. Consequently, the system maintains superior electrical contact even in high-vibration environments, where traditional screw terminals might loosen over time.
Module Hot-Swappability Support: The design preserves field wiring integrity during module replacement. Maintenance teams can swap out I/O modules without disconnecting individual wires, which directly reduces Mean Time to Repair (MTTR) and prevents process downtime.
Robust Wire Gauge Compatibility: The terminal pins support a wide range of wire sizes from 16 to 24 AWG ($0.20 mm^2$ to $1.42 mm^2$). Therefore, the block remains compatible with various industrial sensors, actuators, and power distributions.
Primary Industry Applications
Distributed Control Systems (DCS): Provides the primary wiring interface for remote I/O drops in large-scale plant automation.
Automotive Manufacturing: Facilitates rapid re-tooling and modular assembly line updates due to its connectorized design.
Water and Wastewater Treatment: Ensures long-term reliability for remote monitoring stations where environmental vibration and ease of maintenance are critical.
Material Handling: Used in conveyor control systems where modularity allows for quick expansion of I/O points.
Technical Product Specifications
Manufacturer: General Electric (GE) / Fanuc
Model Number: IC670CHS003
Product Series: Field Control I/O
Module Type: Connector-Style Terminal Block
Connector Type: 20-pin male (AMP 178289-8)
Contact Compatibility: AMP D-3000 series (175217-5 or 175218-5)
The GE IC694MDL645, also cataloged as the IC694MDL645 Digital Input Module, operates as a dedicated hardware component for signal acquisition within PACSystems RX3i control networks. Incoming field signals are processed through sixteen discrete channels, and the resulting state data is transmitted to the backplane. Electrical compatibility with both positive and negative logic configurations is maintained, and operational states are continuously monitored via integrated LED indicators.
Hardware Specifications
Parameter
Specification
Model
IC694MDL645
Brand
GE
Origin
USA
Weight
0.3 kg
Dimensions
3.5 cm x 13.2 cm x 13.5 cm
Operating Temp
Standard Industrial Range
Power Consumption
Backplane Dependent
Input Channels
16
Rated Voltage
24 VDC
ON-state Voltage
11.5 VDC to 30 VDC
OFF-state Voltage
0 VDC to 5 VDC
Response Time
7 ms (typical)
PLC and Control Network Integration
System communication velocity and deterministic performance are regulated by the PACSystems backplane architecture. Signal integrity is preserved through high-level galvanic isolation, rated at 1500 VAC for one minute, whereby electrical noise interference is mitigated. Furthermore, firmware flash compatibility is ensured during module replacement, provided that the backplane remains energized within the specified voltage tolerances. The module is engineered for integration within both local and remote RX3i I/O racks, while support for RX7i systems is provided exclusively in distributed I/O configurations.
Frequently Asked Questions
Q: Is the module capable of being hot-swapped while the system is powered?A: Yes, the module is designed to be extracted and inserted while the RX3i backplane is energized; however, field wiring must be verified to ensure no short-circuit conditions are created during the removal process.Q: How is the signal response time managed in high-speed applications?A: A typical response time of 7 milliseconds is imposed by the hardware filter circuits. This latency is inherent and should be accounted for when high-speed pulse capture is required.
Field Installation Guidelines
The module is to be mounted onto the designated RX3i backplane slot. A mechanical click is heard when the module is fully seated.
Prior to wiring, the 24 VDC power supply must be verified for voltage stability.
Signal wires are to be connected to the terminal block. A secure, firm connection is required to prevent intermittent signal loss caused by vibration.
Shielding must be grounded at the designated earth terminal to ensure that electromagnetic interference is properly diverted.
Once the module is seated and wired, the status LEDs are to be inspected for illumination corresponding to active field device states.
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