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SKU: IC697CPM790

GE Fanuc IC697CPM790 Central Processing Unit

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The GE Fanuc IC697CPM790, also cataloged as the IC697CPM790 Central Processing Unit, operates as a dedicated hardware component for high-speed instruction execution and backplane bus coordination within Series 90-70 platforms.

Hardware Specifications

ParameterSpecification
ModelIC697CPM790
BrandGE
OriginUSA
Weight0.8 kg
Dimensions4 x 21.8 x 29.1 cm
Operating Temp0 deg C to 60 deg C
Power Consumption / Performance64 MHz 80486DX2 microprocessor; 1 MB battery-backed memory

Backplane Bus Communication and Firmware Compatibility

The module integrates directly into the Series 90-70 backplane architecture, facilitating deterministic network data exchange and high-speed communication across distributed I/O racks. Firmware flash compatibility ensures seamless system upgrades through standard programming terminals without altering physical wiring layouts, while backplane bus communication velocity licenses govern synchronous master-slave polling rates.

Frequently Asked Questions

Q: What is the processing scan rate executed by this CPU module?

A: The onboard 64 MHz processor achieves a nominal scan rate of 0.4 microseconds per boolean instruction function.

Q: How is memory protected during sudden input power loss?

A: The system utilizes 1 MB of battery-backed internal memory to preserve user logic programs and register states during outages.

Field Installation Guidelines

Power down the system rack completely prior to inserting or extracting the CPU module to prevent backplane bus terminal arcing. Align the module card edges precisely with the designated rack guide slots, press firmly to seat the board connectors into the backplane receptacles, and secure the top and bottom retaining screws to maintain proper mechanical and electrical ground continuity.

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Hardware Specifications

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OFF-state Voltage0 VAC to 40 VAC

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System communication velocity and deterministic performance are regulated by the VersaMax backplane architecture. Backplane bus communication velocity is optimized to ensure low-latency data throughput for high-density I/O configurations. Furthermore, firmware flash compatibility is supported, allowing for field updates when the module is integrated into existing VersaMax PLC frameworks. To maintain operational stability, I/O density scaling is managed through the modular backplane, which facilitates the addition of supplemental discrete or analog modules without interrupting the host processor scan cycle.

Frequently Asked Questions

Q: Is the module capable of being hot-swapped while the backplane is energized?A: Yes, the module is designed to support hot-swapping. However, care must be taken to ensure that field wiring is disconnected or secured to prevent accidental shorting of the AC input terminals during extraction.Q: How is the group isolation managed across the sixteen channels?A: The sixteen inputs are organized into two groups of eight. While there is no point-to-point isolation, 1500 VAC of group isolation is provided for a duration of one minute to protect against common-mode electrical transients.

Field Installation Guidelines

  • The module is intended for mounting onto a DIN-rail supported I/O carrier. The module must be seated firmly until a physical click is confirmed.
  • Field wiring is connected via the integrated snap-in terminal blocks. Standard industrial torque specifications should be applied to prevent contact resistance.
  • AC input leads must be routed away from low-voltage communication cables to mitigate electromagnetic interference.
  • Status LEDs should be verified for correct illumination cycles upon the application of field power. If an LED fails to trigger during a signal state change, the input wiring and voltage levels must be measured against the technical specifications.
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Frequently Asked Questions

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  • Verify proper seating within the insert-slots of the I/O carrier to ensure the mechanical and electrical integrity of the VersaMax I/O assembly.
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