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SKU: K2LCN-4 51402615-400

Honeywell K2LCN-4 51402615-400 TDC 3000 PCB Card

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  • Configured for local control network routing and high-density memory processing in Honeywell TDC 3000 DCS node chassis, the Honeywell K2LCN-4 51402615-400 (K2LCN-4 PCB Card) provides direct physical/electrical execution. It handles real-time node interaction and high-speed data transfer across the local control network infrastructure, serving as an integrated local control network board configured with 4 megawords of onboard memory.

    Hardware Specifications

    ParameterSpecification
    ModelK2LCN-4 51402615-400
    BrandHoneywell
    OriginUSA
    Weight0.92 kg
    Dimensions36.6 x 36.3 x 2 cm
    Operating Temp0 to 60 deg C
    Power ConsumptionStandard TDC 3000 Backplane Power
    Module TypePCB Card
    SystemTDC 3000 DCS
    Memory Capacity4 Megawords
    Communication ServiceEthernet / LCN Router Board
    HS Code8537101190

    Process Control & Channel Isolation

    The Honeywell K2LCN-4 51402615-400 integrates within the TDC 3000 backplane to facilitate deterministic channel-to-channel communication across industrial process networks. Utilizing onboard memory capacity combined with dedicated transceiver paths, the assembly supports 4-20 mA HART loop protocol routing and multi-node synchronization while maintaining galvanic separation to suppress electrical noise and ground loops across node drops.

    Frequently Asked Questions

    Q: What is the primary function of the 4 megawords memory allocation on the board?

    A: The onboard 4 megawords memory provides local storage for execution code, communication buffer queues, and network state management required for real-time node routing within the Local Control Network (LCN).

    Q: Can the K2LCN-4 card be inserted while the node chassis is powered?

    A: Insertion or removal must follow Honeywell TDC 3000 maintenance procedures. Power down the card slot or rack segment prior to removal to prevent transient current surges on the backplane bus.

    Field Installation Guidelines

    1. Ensure main chassis power is disconnected before sliding the module into the designated TDC 3000 card cage slot.
    2. Align the board edges strictly with the card cage guide rails to prevent mechanical pin bending on the rear connector matrix.
    3. Apply firm, even pressure on the card edge ejector levers until the board seats fully into the backplane socket.
    4. Fasten all retention screws to secure chassis grounding continuity and mechanical stability under vibration.
    5. Verify shield ground terminations on external communication cables to maintain proper channel-to-channel isolation and noise immunity.
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Process Control & Signal Characteristics

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  • The module utilizes channel-to-channel isolation to maintain signal integrity, which effectively prevents the propagation of ground loops or common-mode noise across the control network.

  • The architecture incorporates advanced conditioning logic to support real-time data throughput and ensures deterministic communication latency.

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Field Installation Guidelines

  • First, verify that the module keying is correctly aligned with the I/O carrier rails to prevent potential pin damage during insertion.
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  • Meanwhile, tighten the captive faceplate fasteners to the specified torque to ensure proper chassis ground contact and mechanical stability.
  • Furthermore, ensure all optical or electrical cabling is routed through designated cable management ducts to minimize mechanical strain on the module ports.
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  • Physical Profile: 3.0 cm x 13.5 cm x 23.7 cm
  • Unit Weight: 0.18 kg
  • Manufacturing Origin: USA
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