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SKU: 2711P-RP1X

Allen Bradley 2711P-RP1X PanelView Plus Logic Module

The Allen Bradley 2711P-RP1X, also cataloged as the 2711P-RP1 Logic Module, operates as a dedicated hardware component for graphical execution and display processing within PanelView Plus terminal architectures.

Hardware Specifications

ParameterSpecification
Model2711P-RP1X
BrandAllen Bradley
OriginUSA
Weight0.66 kg
Dimensions20.8 x 14.0 x 4.5 cm
Operating Temp0 to 55 deg C
Power Consumption15 W max
System TypePanelView Plus HMI System
OS EnvironmentWindows CE .NET
HS Code8537101190

EtherNet/IP Deterministic Networks & Backplane Scaling

The module executes real-time protocol processing for deterministic EtherNet/IP communications across backplane architectures. Dedicated onboard memory registers handle high-density I/O polling and tag synchronization directly from ControlLogix processors without CPU cycle starvation. High-speed bus arbitration ensures minimal latency during real-time data frame transfers between external PLC controllers and internal application runtime instances.

Frequently Asked Questions

Q: Can the 2711P-RP1X logic module be attached to any PanelView Plus display module size?

A: The module mechanically attaches to PanelView Plus display modules ranging from 700 to 1500 series configurations using standard retention screws.

Q: How is thermal dissipation handled during continuous panel enclosure mounting?

A: Heat dissipation occurs passively via the rear enclosure heat sink ribs; maintaining 50 mm clearance around all ventilation slots prevents internal thermal throttling.

Field Installation Guidelines

  • Disconnect all primary DC power inputs from the terminal base prior to mating or unseating the logic module from the display housing.
  • Torque all rear structural locking screws to 1.1 Nm (10 in-lb) to maintain uniform contact force across internal board-to-board connectors.
  • Route network communication cables through dedicated wire raceways separated from 120/230 VAC power feeds by at least 200 mm.
  • Verify proper panel ground bond resistance of less than 1 ohm between the module chassis ground terminal and the main enclosure earth bus.